SERVIFORM AT DIETECH EXPO 2025
THE FUTURE IS NOW

Dear Customers, Suppliers and Partners,
We are already full steam ahead for the preparation of our participation to DieTechExpo 2025, the most important European event dedicated to the diemaking industry. Our dear and well estimated ESU Technology Forum has really made some great transformations which range from the name over the content to the location. In fact, the event will take place in Prague, Czech Republic at PVA EXPO PRAHA on October 16–17, 2025.

DieTechExpo is taking a logical step forward, enhancing its appeal to die manufactuers’ customers, especially in the packaging and corrugated cardboard sectors.
DieTechExpo 2025 will offer a wide assortment from the field of paper converting, diemaking and diecutting, foil stamping&embossing, speciality effects processes for the folding carton, corrugated, print finishing, specialty markets like honeycomb and thermoforming as well as others.

As Serviform, we will exhibit two exclusive new machines in our booth and are preparing to show them in working conditions. Our top tech and sales team consisting in Mauro Tomelleri (Central Sales), Angelo Cantini (CEO), Marco Colombo (Sales Italy), Marco Tadini (Export Sales), Alberto Raimondi (Sales Italy), Dino Nozza (Central Training&Installation) and most of our European agents, will be available for all questions you may want to address.

Here our machines you will be able to see in production conditions:
IntegraALL, the new evolution of our Integra Crease covering all the needs for straight rule including same height custom cut/crease rule
HoneyBEND the new machine expressly designed for the need of the honeycomb material processing and for the high rules for technical dies.

We are looking forward to welcoming you at DieTechExpo 2025 in October, see you there!
All the best,
Team Serviform